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Institution Date Title Author
國立成功大學 2019-01-14 銅/錫/銅接點之室溫電遷移材料反應行為研究 梁鍵隴; Liang, Chien-Lung
國立成功大學 2019-01-14 銅/錫/銅接點之室溫電遷移材料反應行為研究 梁鍵隴; Liang, Chien-Lung
國立成功大學 2016-01 Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei
國立成功大學 2015-12-01 High dislocation density of tin induced by electric current Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T.
國立成功大學 2015-03-17 Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint During Pre-con and TCT Tests Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei

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