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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2006-04 An optimization analysis of UBM thicknesses and solder geometry on a wafer level chip scale package using robust methods Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng; Liang, Gin-Tiao

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