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| 臺大學術典藏 |
2022-09-21T23:30:16Z |
Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies
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Liao, Bo Zhou; Chen, Liang Hsi; Chen, Kai Cheng; Lin, Hong Yi; Tsai, Yi Ting; Chen, Ting Wei; Chan, Yi Cheng; Lee, Min Hung; MING-HAN LIAO |
| 臺大學術典藏 |
2021-02-02T09:21:27Z |
Multi-ferroic properties on bifeo3/batio3 multi-layer thin-film structures with the strong magneto-electric effect for the application of magneto-electric devices
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Hu, Cheng Wei; Yen, Ching Min; Feng, Yu Chia; Chen, Liang Hsi; Liao, Bo Zhou; Chen, Sheng Chi; MING-HAN LIAO |
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