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Taiwan Academic Institutional Repository >
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"lin han wen"
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| 國立交通大學 |
2019-04-03T06:43:33Z |
Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Lu, Chia-Ling; Chen, Chih |
| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:52:55Z |
Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing
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Chen, Ming-Yao; Lin, Han-wen; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
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Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
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Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-05-12T02:59:38Z |
Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same
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Chen Chih; Lin Han-Wen |
| 國立交通大學 |
2014-12-16T06:14:54Z |
Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same
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CHEN Chih; LIN Han-Wen |
| 國立交通大學 |
2014-12-16T06:14:49Z |
CIRCUIT BOARD WITH TWINNED CU CIRCUIT LAYER AND METHOD FOR MANUFACTURING THE SAME
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CHEN Chih; LIN Han-Wen |
| 國立交通大學 |
2014-12-12T02:35:24Z |
以控制銅錫介金屬化合物的晶體方向與形貌改善微電子封裝可靠度之研究
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林漢文; Lin, Han-Wen; 陳智; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:31:05Z |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:49Z |
The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads
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Lin, Han-wen; Lu, Jia-ling; Liu, Chen-min; Chen, Chih; Tu, King-ning; Chen, Delphic; Kuo, Jui-Chao |
| 國立交通大學 |
2014-12-08T15:28:53Z |
Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
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Liu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
Thermomigration of Ti in flip-chip solder joints
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Chen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:19:47Z |
Effects of electromigration on grain rotation behavior of SnAg solders
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Lin, Han-wen; Chen, Chih; Kuo, J. C.; Chen, C. C. |
| 國立成功大學 |
2014-10 |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立政治大學 |
2013-12 |
朱熹歷史思維試探：以對宋初三朝政事之史評為例
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林漢文; Lin, Han-Wen |
| 國立成功大學 |
2013-08 |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立成功大學 |
2012-12 |
Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
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Liu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao |
| 國立臺灣大學 |
2009 |
士論與道理：由宋代士人政治之發展解釋理學的興起脈絡
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林漢文; Lin, Han-Wen |
Showing items 1-25 of 26 (2 Page(s) Totally)
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