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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立成功大學 |
2021-04-22 |
Pixel compensation circuit
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Lin, Chih-Lung;Lin, Jie-An;Deng, Ming-Yang;Wu, Chia-En; 林志隆 |
| 國立成功大學 |
2021-03-26 |
畫素驅動裝置
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林志隆;LIN, CHIH-LUNG;林捷安;LIN, JIE-AN;鄧名揚;DENG, MING-YANG;吳佳恩;WU, CHIA-EN |
| 國立成功大學 |
2020-12-31 |
畫素補償電路
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林志隆;LIN, CHIH-LUNG;林捷安;LIN, JIE-AN;鄧名揚;DENG, MING-YANG;吳佳恩;WU, CHIA-EN |
| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
|
Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-12T02:43:08Z |
低高度銲錫接點在高溫下生成多孔狀Cu3Sn介金屬化合物之研究
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林皆安; Lin, Jie-An; 陳智; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature
|
Lin, Jie An; Chen, Chih |
Showing items 1-7 of 7 (1 Page(s) Totally)
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