| 國立成功大學 |
2012 |
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints
|
Liu, De-Shin; Hsu, Chang-Lin; Kuo, Chia-Yuan; Huang, Ya-Ling; Lin, Kwang-Lung; Shen, Geng-Shin |
| 國立成功大學 |
2003-12 |
A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder
|
Lin, Kwang-Lung; Chen, Kang-I; Shi, Po-Cheng |
| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2003-09 |
Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
|
Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2013-08 |
Connecting Carbon Nanotubes Using Sn
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2003-05-31 |
Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 國立成功大學 |
2007-04 |
Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2013-04 |
Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-08 |
Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration
|
Liu, Yeh-Hsiu; Lin, Kwang-Lung |
| 國立成功大學 |
2009-12 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
|
Mittal, Jagjiwan; Kuo, Shih-Ming; Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2012-04 |
Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current
|
Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2006-05 |
Dissolution behavior of Cu and Ag substrates in molten solders
|
Yeh, Po-Yi; Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2004-09 |
Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys
|
Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2005-03 |
Early dissolution behavior of copper in a molten Sn-Zn-Ag solder
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2005-05 |
Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2008 |
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2014-12 |
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
|
Liu, Chin-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2002-11 |
Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2008 |
Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip
|
Lin, Kwang-Lung; Chen, S. Y.; Mohanty, Udit-Surya |
| 國立成功大學 |
2012-12 |
Effect of Ga on the Oxidation Properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa Solders
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2003-12 |
Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
|
Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2005-10 |
Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
