臺大學術典藏 |
2020-05-04T08:03:02Z |
Dynamic Channel Allocation for wireless zone-based Multicast and Broadcast Service
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Lin, Z.-C.;Fu, H.-L.;Lin, P.; Lin, Z.-C.; Fu, H.-L.; Lin, P.; PHONE LIN |
臺大學術典藏 |
2020-01-13T08:20:11Z |
Study of anisotropy of nitinol and radiopaque nitinol hypotube
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Lin, Z.C.; Mackiewicz, D.; Anukhin, B.; Hsiao, H.-M.; Pike, K.; HAO-MING HSIAO |
國立臺灣科技大學 |
2019 |
A Study of Improvements for Aquarium Light Bracket Structure
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Lin, Z.C.;Hou, Z.T.;Lai, Y.W. |
臺大學術典藏 |
2018-09-10T04:47:28Z |
Biocompatibility and biostability of a series of poly(carbonate)urethanes
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Hsu, S.-H.; Lin, Z.-C.; SHAN-HUI HSU |
臺大學術典藏 |
2018-09-10T04:47:27Z |
Enhanced biocompatibility in biostable poly(carbonate)urethane
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Hsu, S.-H.; Kao, Y.-C.; Lin, Z.-C.; SHAN-HUI HSU |
國立臺灣科技大學 |
2018 |
Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer
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Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H. |
國立臺灣科技大學 |
2018 |
Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
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Lin Z.-C.; Wang R.-Y.; Jhang Z.-W. |
國立臺灣科技大學 |
2018 |
Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer
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Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H. |
國立臺灣科技大學 |
2017 |
Investigatory nanoscale thickness of the chemical reaction layer of sapphire substrate for the various dipping temperatures of slurry suitable in CMP
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Lin, Z.-C;Ding, H.-Y;Ma, S.-H. |
國立臺灣科技大學 |
2017 |
Fatigue Strength Analysis and Engineering Knowledge Framework of Multi-Layer Support Structure of A Ro/ro ship
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Lin, Z.-C.;Cheng, Cheng C.-H. |
國立臺灣科技大學 |
2017 |
A study of patent analysis of LED bicycle light by using modified DEMATEL and life span
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Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F. |
國立臺灣科技大學 |
2017 |
Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight
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Lin, Z.-C.;Lin, M.-H.;Hong, G.-E. |
國立臺灣科技大學 |
2017 |
Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis
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Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H. |
國立臺灣科技大學 |
2017 |
Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing
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Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y. |
國立臺灣科技大學 |
2017 |
A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry
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Lin Z.-C.; Ding H.-Y.; Chen P.-Y. |
國立臺灣科技大學 |
2016 |
Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process
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Lin, Z.-C;Wu, D.-W;Hong, G.-E. |
國立臺灣科技大學 |
2016 |
Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
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Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W. |
國立臺灣科技大學 |
2015 |
Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad
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Lin, Z.-C.;Wang, R.-Y. |
國立臺灣科技大學 |
2015 |
An innovative method and experiment for fabricating bulgy shape nanochannel using AFM
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Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y. |
國立臺灣科技大學 |
2015 |
Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon
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Lin, Z.-C;Lin, C.-T;Hsu, Y.-C. |
國立交通大學 |
2014-12-08T15:15:56Z |
Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy
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Lin, S. D.; Lin, Z. C.; Lee, C. P. |
國立交通大學 |
2014-12-08T15:14:39Z |
Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires
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Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W. |
國立交通大學 |
2014-12-08T15:12:46Z |
Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates
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Lin, Z. C.; Lin, S. D.; Lee, C. P. |
國立臺灣科技大學 |
2014 |
Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes
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Lin, Z.-C.;Wang, R.-Y. |
國立臺灣科技大學 |
2014 |
Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method
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Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C. |