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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
臺大學術典藏 2020-05-04T08:03:02Z Dynamic Channel Allocation for wireless zone-based Multicast and Broadcast Service Lin, Z.-C.;Fu, H.-L.;Lin, P.; Lin, Z.-C.; Fu, H.-L.; Lin, P.; PHONE LIN
臺大學術典藏 2020-01-13T08:20:11Z Study of anisotropy of nitinol and radiopaque nitinol hypotube Lin, Z.C.; Mackiewicz, D.; Anukhin, B.; Hsiao, H.-M.; Pike, K.; HAO-MING HSIAO
國立臺灣科技大學 2019 A Study of Improvements for Aquarium Light Bracket Structure Lin, Z.C.;Hou, Z.T.;Lai, Y.W.
臺大學術典藏 2018-09-10T04:47:28Z Biocompatibility and biostability of a series of poly(carbonate)urethanes Hsu, S.-H.; Lin, Z.-C.; SHAN-HUI HSU
臺大學術典藏 2018-09-10T04:47:27Z Enhanced biocompatibility in biostable poly(carbonate)urethane Hsu, S.-H.; Kao, Y.-C.; Lin, Z.-C.; SHAN-HUI HSU
國立臺灣科技大學 2018 Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H.
國立臺灣科技大學 2018 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin Z.-C.; Wang R.-Y.; Jhang Z.-W.
國立臺灣科技大學 2018 Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H.
國立臺灣科技大學 2017 Investigatory nanoscale thickness of the chemical reaction layer of sapphire substrate for the various dipping temperatures of slurry suitable in CMP Lin, Z.-C;Ding, H.-Y;Ma, S.-H.
國立臺灣科技大學 2017 Fatigue Strength Analysis and Engineering Knowledge Framework of Multi-Layer Support Structure of A Ro/ro ship Lin, Z.-C.;Cheng, Cheng C.-H.
國立臺灣科技大學 2017 A study of patent analysis of LED bicycle light by using modified DEMATEL and life span Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F.
國立臺灣科技大學 2017 Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight Lin, Z.-C.;Lin, M.-H.;Hong, G.-E.
國立臺灣科技大學 2017 Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H.
國立臺灣科技大學 2017 Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y.
國立臺灣科技大學 2017 A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry Lin Z.-C.; Ding H.-Y.; Chen P.-Y.
國立臺灣科技大學 2016 Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process Lin, Z.-C;Wu, D.-W;Hong, G.-E.
國立臺灣科技大學 2016 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.
國立臺灣科技大學 2015 Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2015 An innovative method and experiment for fabricating bulgy shape nanochannel using AFM Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y.
國立臺灣科技大學 2015 Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon Lin, Z.-C;Lin, C.-T;Hsu, Y.-C.
國立交通大學 2014-12-08T15:15:56Z Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy Lin, S. D.; Lin, Z. C.; Lee, C. P.
國立交通大學 2014-12-08T15:14:39Z Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W.
國立交通大學 2014-12-08T15:12:46Z Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates Lin, Z. C.; Lin, S. D.; Lee, C. P.
國立臺灣科技大學 2014 Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2014 Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C.

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