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Institution Date Title Author
元智大學 Nov-15 Adjustable Fixture Structure for 3-dimensional X-ray Computed Tomography Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu
元智大學 Nov-14 Electromigration in Thin-film Solder Joints Cheng-En Ho; Cheng-Hsien Yang; Ling-Huang Hsu
元智大學 Jun-15 Electron Backscatter Diffraction Characterization of Electrolytic Cu Deposition in the Blind-hole Structure: Current Density Effect Cheng-En Ho; Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu
元智大學 Jun-15 Effect of Pd(P) Thickness on the Soldering Reaction between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad Cheng-En Ho; Ling-Huang Hsu; Cheng-Hsien Yang; Ting-Chun Yeh; Pei-Tzu Lee
元智大學 Dec-14 Electron Backscatter Diffraction Characterization of Blind Hole Fillings by Electrolytic Cu Deposition Cheng-En Ho; Ling-Huang Hsu; Chang-Chih Chen; Ming-Kai Lu
元智大學 2014-10-22 Microstructural and Crystallographic Evolutions of Electroplating Cu in Blind Hole Structure Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu; Cheng-En Ho
元智大學 2014-10-22 Microstructural and Crystallographic Evolutions of Electroplating Cu in Blind Hole Structure Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu; Cheng-En Ho
元智大學 2014 利用EBSD及TEM分析Cu-Sn介金屬於三維IC晶片接點之微結構及相轉變 許令煌; Ling-Huang Hsu

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