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Showing items 1-11 of 11 (1 Page(s) Totally)
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| 國立臺灣師範大學 |
2014-12-02T06:42:06Z |
The Application of VLE with 3D Google Earth and Interactive Technology
|
Liou, W. K.; Chang, C. Y |
| 國立臺灣科技大學 |
2013 |
Aging and Cu concentration effects on Sn-9Zn-xCu/Au couples
|
Yen, Y.-W.;Liou, W.-K.;Chen, W.-C.;Chiu, C.-W. |
| 國立臺灣科技大學 |
2012 |
Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders
|
Yen, Y.-W.;Kuo, M.-H.;Liou, W.-K.;Chu, T.-N. |
| 國立臺灣科技大學 |
2011 |
Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer with NiP/Ni/Cu and Ni/Cu Multilayer Systems
|
Yen, Y.W.;Liou, W.K.;Jao, C.C. |
| 國立臺灣科技大學 |
2010 |
Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions
|
Lin S.-K.; Chen K.-D.; Chen H.; Liou W.-K.; Yen Y.-W. |
| 國立臺灣科技大學 |
2009 |
Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate
|
Liou W.-K.; Yen Y.-W.; Jao C.-C. |
| 國立臺灣科技大學 |
2009 |
Phase equilibria of the Au-Sn-Zn ternary system and interfacial reactions in Sn-Zn/Au couples
|
Liou W.-k.; Yen Y.-W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2009 |
Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates
|
Liou, W.K.;Yen, Y.W.;Jao, C.C. |
| 國立臺灣科技大學 |
2007 |
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
|
Yen, Y.-W.;Liou, W.-K. |
Showing items 1-11 of 11 (1 Page(s) Totally)
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