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"liu pc"
Showing items 11-20 of 57 (6 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:47:21Z |
Recursive wiener filter for motion parameter estimation in three-parameter motion model
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Liu, PC; Chang, WT |
| 國立交通大學 |
2014-12-08T15:42:48Z |
High-temperature healing of interfacial voids in GaAs wafer bonding
|
Wu, YCS; Liu, PC; Feigelson, RS; Route, RK |
| 國立交通大學 |
2014-12-08T15:38:57Z |
Tin whisker growth driven by electrical currents
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Liu, SH; Chen, C; Liu, PC; Chou, T |
| 國立交通大學 |
2014-12-08T15:37:17Z |
Effects of annealing temperature on electrical resistance of bonded n-GaAs wafers
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Liu, PC; Lu, CL; Wu, YCS; Cheng, JH; Ouyang, H |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
|
Liu, PC; Wu, YCS |
| 國立交通大學 |
2014-12-08T15:27:24Z |
Wiener filter for zoom parameter estimation in three-parameter motion model
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Liu, PC; Shen, WZ; Chang, WT |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Decoupling control of pickup head motion in near-field optical disk drives
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Liu, TS; Liu, PC |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
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Liu, PC; Hou, CY; Wu, YCS |
| 國立交通大學 |
2014-12-08T15:25:29Z |
A generic software framework for the software system architecture design and implementation of handset devices
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Liu, PC; Tsai, MJ; Chen, DJ |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
|
Liu, PC; Hou, CY; Wu, YCS |
Showing items 11-20 of 57 (6 Page(s) Totally)
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