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Institution Date Title Author
國立交通大學 2017-04-21T06:48:31Z Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning
國立交通大學 2015-07-21T11:20:25Z Extremely anisotropic single-crystal growth in nanotwinned copper Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning
國立交通大學 2014-12-12T01:39:56Z 以直流電製備奈米雙晶銅及其在3D IC 封裝之應用 劉道奇; Liu, Tao-Chi; 陳智; Chen, Chih
國立交通大學 2014-12-08T15:30:26Z Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging Liu, Tao-Chi; Huang, Yi-Sa; Chen, Chih
國立交通大學 2014-12-08T15:29:09Z Eliminate Kirkendall voids in solder reactions on nanotwinned copper Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning
國立交通大學 2014-12-08T15:28:53Z Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam Liu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao
國立交通大學 2014-12-08T15:28:15Z Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition Liu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih
國立交通大學 2014-12-08T15:26:38Z Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices Liu, Tao-Chi; Chen, Chih; Liu, Shih-Ting; Chang, Ming-Lun; Lin, Jandel
國立交通大學 2014-12-08T15:23:13Z Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.
國立成功大學 2014-10 Extremely anisotropic single-crystal growth in nanotwinned copper Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning
國立成功大學 2012-12 Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam Liu, Tao-Chi; Chen, Chih; Chiu, Kuo-Jung; Lin, Han-Wen; Kuo, Jui-Chao

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