臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2005-08	Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration	Liu, Yeh-Hsiu; Lin, Kwang-Lung
國立成功大學	2005-07-15	高鉛與共晶錫鉛複合銲錫隆點與底層金屬之界面反應及電遷移行為	劉業繡; Liu, Yeh-Hsiu
國立成功大學	2005-07-15	高鉛與共晶錫鉛複合銲錫隆點與底層金屬之界面反應及電遷移行為	劉業繡; Liu, Yeh-Hsiu
國立成功大學	2004-08	Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test	Liu, Yeh-Hsiu; Chuang, Chiang-Ming; Lin, Kwang-Lung
國立成功大學	2003-08-01	The cathode current efficiency of flip-chip solder bump plating	Lin, Kwang-Lung; Liu, Yeh-Hsiu

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