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机构 日期 题名 作者
國立交通大學 2014-12-08T15:46:32Z Effects of BF2+ implantation on the oxidation resistance of copper films Wu, ZC; Liu, YL; Chen, MC
國立交通大學 2014-12-08T15:46:06Z Electrical reliability issues of integrating thin Ta and TaN barriers with Cu and low-K dielectric Wu, ZC; Wang, CC; Wu, RG; Liu, YL; Chen, PS; Zhu, ZM; Chen, MC; Chen, JF; Chang, CI; Chen, LJ
國立交通大學 2014-12-08T15:45:47Z Passivation of copper films with magnesium doping using recoil ion implantation Wu, ZC; Liu, YL; Chen, MC
國立交通大學 2014-12-08T15:44:56Z Dissociation kinetics of cerium(III) complexes of macrocyclic polyaza polycarboxylate ligands TETA and DOTA Chang, CA; Liu, YL
國立交通大學 2014-12-08T15:43:49Z Dielectric and barrier properties of spin-on organic aromatic low dielectric constant polymers FLARE and SiLK Wu, ZC; Shiung, ZW; Wu, RG; Liu, YL; Wu, WH; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Hu, CH; Liang, MS
國立交通大學 2014-12-08T15:43:38Z Ligand preorganization in metal ion complexation: Molecular mechanics/dynamics, kinetics, and laser-excited luminescence studies of trivalent lanthanide complex formation with macrocyclic ligands TETA and DOTA Chang, CA; Liu, YL; Chen, CY; Chou, XM
國立交通大學 2014-12-08T15:27:01Z Electrical reliability issues of integrating low-K dielectrics with Cu metallization Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:25:35Z An object based authoring tool for creating SCORM compliant course Su, JM; Tseng, SS; Weng, JF; Chen, KT; Liu, YL; Tsai, YT
國立交通大學 2014-12-08T15:16:23Z Epoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis(glycidyidimethylsiloxy)octasilsesquioxane and small-molecule curing agents Liu, YL; Chang, GP; Hsu, KY; Chang, FC
國立交通大學 2014-12-08T15:04:35Z ENHANCED O2 PLASMA STRIPPING OF P+ AND SI+ IMPLANTED NEGATIVE RESIST BY H2 PLASMA PRETREATMENT LOONG, WA; YEN, MS; WANG, FC; HSU, BY; LIU, YL

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