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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立交通大學 |
2017-04-21T06:48:56Z |
Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure
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Shih, Jian-Yu; Chen, Yen-Chi; Lee, Shih-Wei; Hu, Yu-Chen; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A Novel Si-based X'tal Oscillator Device Using 3D Integration Technologies
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chen, Kuan-Neng |
| 國立交通大學 |
2015-07-21T11:20:27Z |
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-07-21T08:28:28Z |
Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies
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Shih, Jian-Yu; Chen, Yen-Chi; Chiang, Cheng-Hao; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:31:58Z |
Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic Sealing
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Shih, Jian-Yu; Chen, Yen-Chi; Chiu, Chih-Hung; Hu, Yu-Chen; Lo, Chung-Lun; Chang, Chi-Chung; Chen, Kuan-Neng |
Showing items 1-6 of 6 (1 Page(s) Totally)
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