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"lo wei chung"
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| 臺大學術典藏 |
2021-07-21T23:20:58Z |
CMOS-compatible GaN HEMT on 200mm Si-substrate for RF application
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Yeh, Po Chun; Tu, Po Tsung; Liu, Hsueh Hsing; Hsu, Chien Hua; Yang, Hsin Yun; Fu, Yi Keng; Lee, Li Heng; Tzeng, Pei Jer; YUH-RENN WU; Sheu, Shyh Shyuan; Lo, Wei Chung; CHIH-I WU |
| 國立交通大學 |
2020-10-05T02:01:30Z |
Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC
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Chen, Pin-Jun; Shen, Chih-Ming; Yang, Chih-Chao; Tai, Ming-Chi; Lo, Wei-Chung; Shen, Chang-Hong; Hu, Chenming; Chen, Kuan-Neng |
| 國立交通大學 |
2020-10-05T02:01:28Z |
Monolithic 3D BEOL FinFET switch arrays using location-controlled-grain technique in voltage regulator with better FOM than 2D regulators
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Hsieh, Ping-Yi; Chang, Yi-Jui; Chen, Pin-Jun; Chen, Chun-Liang; Yang, Chih-Chao; Huang, Po-Tsang; Chen, Yi-Jing; Shen, Chih-Ming; Liu, Yu-Wei; Huang, Chien-Chi; Tai, Ming-Chi; Lo, Wei-Chung; Shen, Chang-Hong; Shieh, Jia-Min; Chang, Da-Chiang; Chen, Kuan-Neng; Yeh, Wen-Kuan; Hu, Chenming |
| 國立交通大學 |
2020-10-05T02:01:28Z |
A Comprehensive Modeling Framework for Ferroelectric Tunnel Junctions
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Huang, Hsin-Hui; Wu, Tzu-Yun; Chu, Yueh-Hua; Wu, Ming-Hung; Hsu, Chien-Hua; Lee, Heng-Yuan; Sheu, Shyh-Shyuan; Lo, Wei-Chung; Hou, Tuo-Hung |
| 國立交通大學 |
2018-08-21T05:53:29Z |
3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)
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Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:12Z |
Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication
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Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-16T06:15:03Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:14:52Z |
HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME
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CHEN KUAN-NENG; KO CHENG-TA; LO WEI-CHUNG |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-16T06:13:53Z |
Heterostructure containing IC and LED and method for fabricating the same
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Chen Kuan-Neng; Ko Cheng-Ta; Lo Wei-Chung |
| 國立交通大學 |
2014-12-08T15:36:21Z |
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid Bonding
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Chang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:23:44Z |
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
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Chen, Kuan-Neng; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Fu, Huan-Chun; Lo, Wei-Chung |
| 國立交通大學 |
2014-12-08T15:23:37Z |
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng |
| 淡江大學 |
2011 |
臺灣中部地區的水資源規劃
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駱威仲; Lo, Wei-Chung |
| 國立勤益科技大學 |
2007 |
射出成形製程參數對光學鏡片品質影響之研究
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雒瑋群; Lo, Wei-Chung |
| 國立臺灣大學 |
1998 |
Synthesis, Crystal Structures, and Magnetic Properties of a Series of Linear Pentanickel(II) Complexes: [Ni5(μ5-tpda)4X2] (X = Cl-, CN-, N3-, NCS-) and [Ni5(μ5-tpda)4(CH3CN)2]- (PF6)2 (tpda2- = the Tripyridyldiamido Dianion)
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Wang, Chih-Chieh; Lo, Wei-Chung; Chou, Chin-Chang; Lee, Gene-Hsiang; Chen, Jin-Ming; Peng, Shie-Ming |
| 東海大學 |
1996 |
高填充熔融高分子之降服行為檢測
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羅維權; Lo, Wei-Chung |
| 國立臺灣大學 |
1994 |
Luminescent metal clusters. Spectroscopic properties and X-ray structure of a trinuclear gold(I) complex containing bis(diphenylphosphino)methane and phenylacetylide
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Che, Chi-Ming; Yip, Hon-Kay; Lo, Wei-Chung; Peng, Shie-Ming |
| 國立臺灣大學 |
1993 |
Luminescent Gold(I) Acetylide Complexes. Photophysical and Photoredox Properties and Crystal Structure of [{Au(C≡CPh)}2(μ-Ph2PCH2CH2PPh2)]
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Li, Dan; Hong, Xiao; Che, Chi-Ming; Lo, Wei-Chung; Peng, Shie-Ming |
| 臺大學術典藏 |
1993 |
Luminescent Gold(I) Acetylide Complexes. Photophysical and Photoredox Properties and Crystal Structure of [{Au(C≡CPh)}2(μ-Ph2PCH2CH2PPh2)]
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Li, Dan; Hong, Xiao; Che, Chi-Ming; Lo, Wei-Chung; Peng, Shie-Ming; Li, Dan; Hong, Xiao; Che, Chi-Ming; Lo, Wei-Chung; Peng, Shie-Ming |
Showing items 1-21 of 21 (1 Page(s) Totally)
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