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| 國立交通大學 |
2019-04-03T06:43:33Z |
Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Lu, Chia-Ling; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
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Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:47Z |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2019-04-02T05:59:29Z |
Growth Mechanism of Self-Assembled TixWyO Nanotubes Fabricated by TiW Alloy Anodization
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Chang, Yung-Huang; Chen, Yuan-Tsung; Huang, Chien-Sheng; Lu, Chia-Ling; Lee, Shih-Hung; Huang, Bohr-Ran; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient
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Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
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Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立成功大學 |
2017-01-16 |
探討體驗店之體驗媒介對體驗價值、品牌偏好、購買意願之影響
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盧嘉翎; Lu, Chia-Ling |
| 國立臺灣海洋大學 |
2017 |
以高溫通氧技術評估食用油脂之品質與安定性
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Lu, Chia-Ling; 呂佳玲 |
Showing items 1-10 of 23 (3 Page(s) Totally)
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