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Showing items 86-95 of 156 (16 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T14:54:08Z |
Radiation pattern measurement assembly for millimeter-wave antenna by flip-chip interconnect and end launch connector
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Lu, H.-C.;Chang, Y.-L.; Lu, H.-C.; Chang, Y.-L.; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:49:15Z |
The NPR1 ortholog PhaNPR1 is required for the induction of PhaPR1 in Phalaenopsis aphrodite
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Chen, J.-C.; Lu, H.-C.; Chen, C.-E.; Hsu, H.-F.; Chen, H.-H.; Yeh, H.-H.; JEN-CHIH CHEN |
| 臺大學術典藏 |
2018-09-10T09:48:45Z |
Characterization of gadolinium oxide thin films with CF4 plasma treatment for resistive switching memory applications
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Wang, J.-C.;Ye, Y.-R.;Lai, C.-S.;Lin, C.-T.;Lu, H.-C.;Wu, C.-I.;Wang, P.-S.; Wang, J.-C.; Ye, Y.-R.; Lai, C.-S.; Lin, C.-T.; Lu, H.-C.; Wu, C.-I.; Wang, P.-S.; CHIH-I WU |
| 臺大學術典藏 |
2018-09-10T09:44:11Z |
Space difference magnetic near-field probe with spatial resolution improvement
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Chou, Y.-T.;Lu, H.-C.; Chou, Y.-T.; Lu, H.-C.; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:44:11Z |
Magnetic near-field probes with high-pass and notch filters for electric field suppression
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Chou, Y.-T.;Lu, H.-C.; Chou, Y.-T.; Lu, H.-C.; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:44:11Z |
Embedded end-fire monopole antenna in low temperature cofired ceramic for 60 GHz
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HSIN-CHIA LU; Tung, W.-S.; Rao, P.-Z.; Lu, H.-C.;Kuo, C.-C.;Chang, Y.-L.;Siao, S.-Y.;Chuang, S.-K.;Rao, P.-Z.;Tung, W.-S.; Lu, H.-C.; Kuo, C.-C.; Chang, Y.-L.; Siao, S.-Y.; Chuang, S.-K. |
| 臺大學術典藏 |
2018-09-10T09:44:11Z |
A K-band compact fully integrated transformer power amplifier in 0.18-μm CMOS
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Kuo, C.-C.;Lin, Y.-H.;Lu, H.-C.;Wang, H.; Kuo, C.-C.; Lin, Y.-H.; Lu, H.-C.; Wang, H.; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:44:11Z |
Performance comparison of flip-chip-assembled 5-GHz 0.18-μm CMOS power amplifiers on different packaging substrates
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Kuo, C.-C.;Hsu, Y.-W.;Huang, W.-C.;Wang, H.;Lu, H.-C.; Kuo, C.-C.; Hsu, Y.-W.; Huang, W.-C.; Wang, H.; Lu, H.-C.; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:21:47Z |
60-GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65-nm flip-chip CMOS process
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Lu, Y.-F.; Huang, T.-Y.; Chang, Y.-L.; Hsieh, Y.-K.; Peng, P.-J.; Chang, I.-C.; Tsai, T.-C.; Kao, K.-Y.; Hsiung, W.-Y.; Wang, J.; Hsu, Y.A.; Lin, K.-Y.; Lu, H.-C.; Lin, Y.-C.; Lu, L.-H.; Huang, T.-W.; Wu, R.-B.; Wang, H.; Kuo, J.-L.; HSIN-CHIA LU; YI-CHENG LIN; KUN-YOU LIN et al. |
| 臺大學術典藏 |
2018-09-10T09:18:01Z |
A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC
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Kuo, C.-C.;Lu, H.-C.;Lin, P.-A.;Tai, C.-F.;Hsin, Y.-M.;Wang, H.; Kuo, C.-C.; Lu, H.-C.; Lin, P.-A.; Tai, C.-F.; Hsin, Y.-M.; Wang, H.; HSIN-CHIA LU; HUEI WANG |
Showing items 86-95 of 156 (16 Page(s) Totally)
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