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Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2014-12-08T15:33:11Z |
Electrical Performances and Structural Designs of Copper Bonding in Wafer-Level Three-Dimensional Integration
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Chen, K. N.; Young, A. M.; Lee, S. H.; Lu, J. -Q. |
國立交通大學 |
2014-12-08T15:11:49Z |
Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications
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Chen, K. N.; Tsang, C. K.; Wu, W. W.; Lee, S. H.; Lu, J. Q. |
國立彰化師範大學 |
1998 |
Magnetic Domain Pinning in Patterned Magneto-Optical Recording Media
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Ye, L. X. ; Chen, L. L. ; Lu, J. Q. ; Chang, H. C. ; Wu, Jong-Ching; Wu, Te-Ho |
Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
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