| 臺大學術典藏 |
2020-06-11T06:44:36Z |
Integrated heterogeneous infrastructure for indoor positioning
|
Ma, Y.-W.;Chen, J.-L.;Tsai, Y.-H.;Chou, P.-C.;Lu, S.-K.;Kuo, S.-Y.; Ma, Y.-W.; Chen, J.-L.; Tsai, Y.-H.; Chou, P.-C.; Lu, S.-K.; Kuo, S.-Y.; SY-YEN KUO |
| 國立臺灣科技大學 |
2020 |
Temperature Sensing with a Relaxation Oscillator in CMOS ICs
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Sako, F.;Ikiri, Y.;Hashizume, M.;Yotsuyanagi, H.;Yokoyama, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2020 |
Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards
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Kanda, M.;Hashizume, M.;Ali, F.A.B.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2020 |
Fault-Aware Dependability Enhancement Techniques for Flash Memories
|
Lu, S.-K.;Yu, S.-C.;Hsu, C.-L.;Sun, C.-T.;Hashizume, M.;Yotsuyanagi, H. |
| 國立臺灣科技大學 |
2020 |
Temperature Sensing with a Relaxation Oscillator in CMOS ICs
|
Sako, F.;Ikiri, Y.;Hashizume, M.;Yotsuyanagi, H.;Yokoyama, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2019 |
Resistive open defect detection in SoCs by a test method based on injected charge volume after test input application
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Matsumoto, Y.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2019 |
Stand-by mode test method of interconnects between dies in 3d ICs with IEEE 1149.1 test circuits
|
Kanda, M.;Yabui, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2019 |
Retention-Aware Refresh Techniques for Reducing Power and Mitigation of Data Retention Faults in DRAM
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Lu, S.-K.;Huang, Huang H.-K.;Hsu, C.-L.;Sun, C.-T.;Miyase, K. |
| 國立臺灣科技大學 |
2019 |
A fault-tolerant MPSoC for CubeSats
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Fuchs, C.M.;Chou, P.;Wen, X.;Murillo, N.M.;Furano, G.;Holst, S.;Tavoularis, A.;Lu, S.-K.;Plaat, A.;Marinis, K. |
| 國立臺灣科技大學 |
2019 |
A static method for analyzing hotspot distribution on the LSI
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Miyase, K.;Kawano, Y.;Lu, S.-K.;Wen, X.;Kajihara, S. |
| 國立臺灣科技大學 |
2018 |
A design for testability of open defects at interconnects in 3D stacked ICs
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Ashikin F.; Hashizume M.; Yotsuyanagi H.; Lu S.-K.; Roth Z. |
| 國立臺灣科技大學 |
2018 |
Address Remapping Techniques for Enhancing Fabrication Yield of Embedded Memories
|
Lu S.-K.; Jheng H.-C.; Lin H.-W.; Hashizume M. |
| 國立臺灣科技大學 |
2018 |
Fault Leveling Techniques for Yield and Reliability Enhancement of NAND Flash Memories
|
Lu S.-K.; Zhong S.-X.; Hashizume M. |
| 國立臺灣科技大學 |
2018 |
A defective level monitor of open defects in 3D ICs with a comparator of offset cancellation type
|
Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2018 |
A defect level monitor of resistive open defect at interconnects in 3D ICs by injected charge volume
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Ohtani, K.;Osato, N.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2018 |
Open defect detection with a built-in test circuit by IDDT appearance time in CMOS ICs
|
Kambara A.; Yotsuyanagi H.; Miyoshi D.; Hashizume M.; Lu S.-K. |
| 國立臺灣科技大學 |
2018 |
Adaptive ECC Techniques for Reliability and Yield Enhancement of Phase Change Memory
|
Lu S.-K.; Li H.-P.; Miyase K. |
| 國立臺灣科技大學 |
2018 |
Fault-aware page address remapping techniques for enhancing yield and reliability of flash memories
|
Lu S.-K.; Yu S.-C.; Hashizume M.; Yotsuyanagi H. |
| 國立臺灣科技大學 |
2018 |
Progressive ECC Techniques for Phase Change Memory
|
Lu, S.-K.;Li, H.-P.;Miyase, K. |
| 國立臺灣科技大學 |
2017 |
Online slack-Time binning for IO-registered die-To-die interconnects
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Zheng, C.-C;Huang, S.-Y;Lu, S.-K;Wang, T.-C;Tsai, K.-H;Cheng, W.-T. |
| 國立臺灣科技大學 |
2017 |
Adaptive block-based refresh techniques for mitigation of data retention faults and reduction of refresh power
|
Lu, S.-K.;Huang, Huang H.-K. |
| 國立臺灣科技大學 |
2017 |
Electrical tests for capacitive open defects in assembled PCBs
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Alia, F.A.B.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
Electrical test of resistive and capacitive open defects at data bus in 3D memory IC
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Hashizume, M.;Shiraishi, Y.;Yotsuyanagi, H.;Yokoyama, H.;Tada, Tada T.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
Resistive open defects detected by interconnect testing based on charge volume injected to 3D ICs
|
Ohtani, K.;Osato, N.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
A built-in current sensor made of a comparator of offset cancellation type for electrical interconnect tests of 3D ICs
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Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A Framework for Third Party Android Marketplaces to Identify Repackaged Apps
|
Lo, N.-W;Lu, S.-K;Chuang, Y.-H. |
| 國立臺灣科技大學 |
2016 |
Integrated heterogeneous infrastructure for indoor positioning
|
Ma, Y.-W;Chen, J.-L;Tsai, Y.-H;Chou, P.-C;Lu, S.-K;Kuo, S.-Y. |
| 國立臺灣科技大學 |
2016 |
Integration of Hard Repair Techniques with ECC for Enhancing Fabrication Yield and Reliability of Embedded Memories
|
Lu, S.-K;Tsai, C.-J;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
A built-in electrical test circuit for detecting open leads in assembled PCB circuits
|
Miyabe, T;Hashizume, M;Yotsuyanagi, H;Lu, S.-K;Roth, Z. |
| 國立臺灣科技大學 |
2016 |
Electrical interconnect test of solder joint part with boundary scan flip flops and a built-in test circuit
|
Hashizume, M;Ikiri, Y;Konishi, T;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Enhanced Built-In Self-Repair Techniques for Improving Fabrication Yield and Reliability of Embedded Memories
|
Lu, S.-K;Tsai, C.-J;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
A built-in test circuit for electrical interconnect testing of open defects in assembled PCBs
|
Widiant, Hashizume M;Suenaga, Suenaga S;Yotsuyanagi, H;Ono, A;Lu, S.-K;Roth, Z. |
| 國立臺灣科技大學 |
2016 |
A power supply circuit for interconnect tests based on injected charge volume of 3D IC
|
Ohtani, K;Hashizume, M;Suga, D;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A built-in defective level monitor of resistive open defects in 3D ICs with logic gates
|
Hashizume, M;Odoriba, A;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Testability for resistive open defects by electrical interconnect test of 3D ICs without boundary scan flip flops
|
Ali, F.A.B;Hashizume, M;Ikiri, Y;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Adaptive ECC Techniques for Yield and Reliability Enhancement of Flash Memories
|
Lu, S.-K;Zhong, S.-X;Hashizume, M. |
| 國立臺灣科技大學 |
2016 |
An enhanced built-in self-repair technique for yield and reliability improvement of embedded memories
|
Lu, S.-K;Lin, H.-W;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Address scrambling and data inversion techniques for yield enhancement of NROM-Based ROMs
|
Lu, S.-K.;Li, T.-L.;Hashizume, M.;Chen, J.-L. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs by injected charge volume
|
Suga, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Hybrid scrambling technique for increasing the fabrication yield of NROM-Based ROMs
|
Lu, S.-K.;Lin, S.-L.;Lin, H.-W.;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit
|
Nanbara, K.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
A testable design for electrical interconnect tests of 3D ICs
|
Odoriba, A.;Umezu, S.;Hashizume, M.;Yotsuyanagi, H.;Ali, F.A.B.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
An enhanced built-in self-repair technique for yield and reliability improvement of embedded memories
|
Lu, S.-K;Lin, H.-W;Hashizume, M. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs without boundary scan flip flops
|
Hashizume, M;Umezu, S;Ikiri, Y;Ali, F.A.B;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2014 |
A power saving mechanism for multimedia streaming services in cloud computing
|
Ma, Y.-W.;Chen, J.-L.;Chou, C.-H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
Testable design for electrical testing of open defects at interconnects in 3D ICs
|
Hashizume, M.;Konishi, T.;Yotsuyanag, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
Error-tolerance evaluation and design techniques for motion estimation computing arrays
|
Lu, S.-K.;Chen, M.-C.;Chen, Y.-C. |
| 國立臺灣科技大學 |
2013 |
Efficient test and repair architectures for 3D TSV-based random access memories
|
Lu, S.-K.;Lu, U.-C.;Pong, S.-W.;Cheng, H.-C. |
| 國立臺灣科技大學 |
2013 |
Reduction method of number of electromagnetic simulation times for estimating output voltage at hard open TSV in 3D IC
|
Haraguchi, E.;Hashizume, M.;Manabe, K.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K.;Roth, Z. |
| 國立臺灣科技大學 |
2013 |
Built-in IDDT appearance time sensor for detecting open faults in 3D IC
|
Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K. |