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Showing items 1-10 of 22 (3 Page(s) Totally)
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| 臺大學術典藏 |
2020-06-29T01:20:10Z |
Test Generation of Path Delay Faults Induced by Defects in Power TSV.
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Shih, Chi-Jih;Hsieh, Shih-An;Lu, Yi-Chang;Li, James Chien-Mo;Wu, Tzong-Lin;Chakrabarty, Krishnendu; Shih, Chi-Jih; Hsieh, Shih-An; Lu, Yi-Chang; Li, James Chien-Mo; Wu, Tzong-Lin; Chakrabarty, Krishnendu; CHIEN-MO LI |
| 臺大學術典藏 |
2020-05-04T08:22:04Z |
Deep Co-occurrence Feature Learning for Visual Object Recognition.
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Shih, Ya-Fang;Yeh, Yang-Ming;Lin, Yen-Yu;Weng, Ming-Fang;Lu, Yi-Chang;Chuang, Yung-Yu; Shih, Ya-Fang; Yeh, Yang-Ming; Lin, Yen-Yu; Weng, Ming-Fang; Lu, Yi-Chang; Chuang, Yung-Yu; YUNG-YU CHUANG |
| 臺大學術典藏 |
2020-05-04T07:27:48Z |
Thermal modeling for 3D-ICs with integrated microchannel cooling.
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Lu, Yi-Chang; Yang, Chia-Lin; Mizunuma, Hitoshi;Yang, Chia-Lin;Lu, Yi-Chang; Mizunuma, Hitoshi; CHIA-LIN YANG |
| 臺大學術典藏 |
2020-05-04T07:27:46Z |
Exploring synergistic DVFS control of cores and DRAMs for thermal efficiency in CMPs with 3D-stacked DRAMs.
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Lin, Ping-Sheng;Chen, Yi-Jung;Yang, Chia-Lin;Lu, Yi-Chang; Lin, Ping-Sheng; Chen, Yi-Jung; Yang, Chia-Lin; Lu, Yi-Chang; CHIA-LIN YANG |
| 臺大學術典藏 |
2020-05-04T07:27:46Z |
Thermal coupling aware task migration using neighboring core search for many-core systems.
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Lu, Yi-Chang; Yang, Chia-Lin; CHIA-LIN YANG; Mizunuma, Hitoshi; Mizunuma, Hitoshi;Lu, Yi-Chang;Yang, Chia-Lin |
| 臺大學術典藏 |
2020-05-04T07:27:42Z |
Opportunities of Synergistically Adjusting Voltage-Frequency Levels of Cores and DRAMs in CMPs with 3D-Stacked DRAMs for Efficient Thermal Control
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Chen, Yi-Jung;Yang, Chia-Lin;Lin, Pin-Sheng;Lu, Yi-Chang; Chen, Yi-Jung; Yang, Chia-Lin; Lin, Pin-Sheng; Lu, Yi-Chang; CHIA-LIN YANG |
| 臺大學術典藏 |
2020-01-13T08:23:00Z |
Cost-effective and channel-scalable hardware decoders for multiple electron-beam direct-write systems
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Yu, Chun-Chang; Lin, Pei-Chun; Lu, Yi-Chang; Chen, Charlie Chung-Ping; PEI-CHUN LIN |
| 臺大學術典藏 |
2018-09-10T08:46:32Z |
Impact of process-effect correction strategies on variability of critical dimension and electrical characteristics in extreme ultraviolet lithography
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Ng, Sheng-Wei ; Chien, Bo-Sen ; Chang, Kuen-Yu ; Tsai*, Yi-Chang ; Lu, Jia-Han ; Li,Alek C.; ChenNg, Philip C.W.; Chien, Sheng-Wei; Chang, Bo-Sen; Tsai, Kuen-Yu; Lu, Yi-Chang; Li, Jia-Han; Chen, Alek C.; Ng, Philip C.W.; Chien, Sheng-Wei; Chang, Bo-Sen; Tsai, Kuen-Yu; Lu, Yi-Chang; Li, Jia-Han; Chen, Alek C.; YI-CHANG LU; KUEN-YU TSAI; Li, Jia-Han |
| 臺大學術典藏 |
2018-09-10T07:37:14Z |
Thermal modeling for 3D-ICs with integrated microchannel cooling
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Mizunuma, Hitoshi;Yang, Chia-Lin;Lu, Yi-Chang; Mizunuma, Hitoshi; Yang, Chia-Lin; Lu, Yi-Chang; YI-CHANG LU |
| 臺大學術典藏 |
2018-09-10T05:58:46Z |
Performance benefits of monolithically stacked 3D-FPGA
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Lin, Mingjie; El Gamal, Abbas; Lu, Yi-Chang; Wong, Simon; YI-CHANG LU |
Showing items 1-10 of 22 (3 Page(s) Totally)
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