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机构 日期 题名 作者
國立成功大學 2020 Improving the applicability of wear-resistant Al–10Si–0.5 Mg alloy obtained through selective laser melting with T6 treatment in high-temperature, and high-wear environments Chen, K.-J.;Hung, F.-Y.;Lui, T.-S.;Tsai, C.-L.
國立成功大學 2020 Microstructure and tensile fracture behavior of three-stage heat treated inconel 718 alloy produced via laser powder bed fusion process Zhao, J.-R.;Hung, F.-Y.;Lui, T.-S.
國立成功大學 2019 Study of electrical fatigue test in gold-coated siliver-4 wt.% palladium bonding wire Ho, C.-C.;Chen, K.-J.;Hung, F.-Y.;Lui, T.-S.
國立成功大學 2019 Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation Wu, Y.-H.;Hung, F.-Y.;Lui, T.-S.;Chen, K.-J.
國立成功大學 2018 Microstructure evolution and microstructural characteristics of Al–Mg–Si aluminum alloys fabricated by a modified strain-induced melting activation process Lin, C.-W.;Hung, F.-Y.;Lui, T.-S.
國立成功大學 2018 Effects of static heat and dynamic current on Al/Zn�Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules Chen, K.-J.;Hung, F.-Y.;Lui, T.-S.;Lin, W.-Y.
國立成功大學 2018 Enhancement of the young’s modulus through infrared heat treatment: A study of the microstructure and the mass effect of real body 6082 aluminum forgings Chang, Y.-L.;Hung, F.-Y.;Lui, T.-S.
國立成功大學 2017 Aluminium wires have the free air balls (FABs): Electronic flame-off, fracture strength, electrical properties, and bonding characteristics of Nano Zn Film Al–Si bonding wires Hung, F.-Y.;Lui, T.-S.;Chu, K.-M.;Tseng, Y.-W.
國立成功大學 2015-03 Electrochemical performance of Ag doped Al0.6Si0.4/Al thin film anodes Wu, C. -H.; Hung, F. -Y.; Lui, T. -S.; Chen, L. -H.
國立臺灣師範大學 2014-10-30T09:36:01Z Effect of heating temperature and magnesium content on the thermal cyclic failure behaviour of ductile irons Cheng, C. P.; Lui, T. S.; Chen, L. H.

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