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"lui truan sheng"的相关文件
显示项目 71-80 / 168 (共17页)
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| 國立成功大學 |
2008-06-12 |
Resonant characteristics of the microelectronic Sn-Cu solder
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; He, Nien-Ting |
| 國立成功大學 |
2008-03 |
Electromagnetic interference shielding characteristics of Sn-Al powder coating layers
|
Hung, Fei-Shuo; Hung, Fei-Yi; Chiang, Che-Ming; Lui, Truan-Sheng |
| 國立成功大學 |
2008-02 |
Influence of austenization temperature on the erosion behavior of austempered ductile irons
|
Chang, L. C.; Hsui, I. C.; Chen, Li-Hui; Lui, Truan-Sheng |
| 國立成功大學 |
2008 |
Microstructural self-healing effect of hydrothermal crystallization on bonding strength and failure mechanism of hydroxyapatite coatings
|
Yang, Chung-Wei; Lui, Truan-Sheng |
| 國立成功大學 |
2007-11 |
Deformation fracture characteristics of microelectronic Sn-3.0Ag-0.5Cu-xNi solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chan, Cheng-Wei |
| 國立成功大學 |
2007-07-15 |
A study of nano-sized surface coating on LiMn2O4 materials
|
Hung, Fei-Yi; Lui, Truan-Sheng; Liao, Hung-Chi |
| 國立成功大學 |
2007-07 |
Vibration behavior of light metals: Al-Zn alloy and Mg-Al-Zn alloy
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Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chang, Han-Wen; Chen, Zong-Fu |
| 國立成功大學 |
2007-07 |
Recrystallization and fracture characteristics of thin copper wire
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Wang, Yuan-Tin |
| 國立成功大學 |
2007-06 |
Vibration fracture behavior of Sn-9Zn-xCu lead-free solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; You, Ji-Ge |
| 國立成功大學 |
2007-06 |
Role of crystallized phases in sheet resistance of amorphous AgInSbTe chalcogenide film
|
Chou, Chien-Chih; Hung, Fei-Yi; Lui, Truan-Sheng |
显示项目 71-80 / 168 (共17页)
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