|
"lung c l"的相关文件
显示项目 1-7 / 7 (共1页)
1
每页显示[10|25|50]项目
| 臺大學術典藏 |
2020-01-13T08:23:07Z |
Design and implementation of 3D-thermal test chip for exploration of package effects
|
Chien, J.-H.; Lung, C.-L.; Lin, T.-W.; Tsai, K.-J.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:07Z |
Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons
|
Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
|
Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
|
Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2018-09-10T09:18:50Z |
Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
|
Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2018-09-10T08:37:34Z |
Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons
|
Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
1982 |
A convenient synthesis of 7-substituted norbornadienes
|
Luh, T.-Y.; Lung, C.L.; TIEN-YAU LUH |
显示项目 1-7 / 7 (共1页)
1
每页显示[10|25|50]项目
|
