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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
元智大學 Jul-15 Field emission lamps prepared with dip-coated and nickel electroless plated carbon nanotube cathodes N.W. Pu; M.J. Youh; Y.M. Liu; K. J. Chung; M. D. Ger
元智大學 2021-11-13 Effects of Fast Heating and Liquid-Nitrogen Quench on the Morphology and Microwave Absorption Performance of Expanded Graphite S.H. Chen; Y.C. Chen; H.T. Li; H.Y. Hsieh; B.Y. Liu; Y.J. Chen; W.C. Wu; H.H. Peng; N.W. Pu; M.D. Ger; Y.M. Liu; M.H. Lin; M.J. Youh
元智大學 2021-11-13 Study on the application of boron-doped holey graphene to organic-electrolyte supercapacitors H.Y. Hseih; N.W. Pu; M.D. Ger; Y.M. Liu; M.H. Lin; M.J. Youh; J.K. Chang; C.H. Lan; N.J. Zheng; C.H. Chou
元智大學 2014-06-10 Production of composite conductive adhesives using core-shell metal particles and graphene as conductive fillers W.F. Ke; Y.Y.Peng; N.W. Pu; Y.M. Liu; M.D. Ger; C.H. Wu; Y.Y.Peng
元智大學 2014-06-10 Production of composite conductive adhesives using core-shell metal particles and graphene as conductive fillers W.F. Ke; Y.Y.Peng; N.W. Pu; Y.M. Liu; M.D. Ger; C.H. Wu; Y.Y.Peng
元智大學 2014-06-10 Production of composite conductive adhesives using core-shell metal particles and graphene as conductive fillers W.F. Ke; Y.Y.Peng; N.W. Pu; Y.M. Liu; M.D. Ger; C.H. Wu; Y.Y.Peng
元智大學 2014-06-10 Production of composite conductive adhesives using core-shell metal particles and graphene as conductive fillers W.F. Ke; Y.Y.Peng; N.W. Pu; Y.M. Liu; M.D. Ger; C.H. Wu; Y.Y.Peng
元智大學 2014-06-10 Production of composite conductive adhesives using core-shell metal particles and graphene as conductive fillers W.F. Ku; Y.Y.Peng; N.W. Pu; Y.M. Liu; M.D. Ger; C.H. Wu
元智大學 2014-06-10 Using modified xGnP/AlN composites to produce high-electrical-resistivity thermally-conductive phase change materials C.W. Liao; C.H. Wu; N.W. Pu; Y.M. Liu; M.D. Ger; Chien-Liang Chang
元智大學 2014-06-10 Improving the quality of graphene transparent conductive films by removing the oxidation debris B.H. Jian; P.J. Wu; B.R. Wu; N.W. Pu; Y.M. Liu; M.D. Ger

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