臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 1-10 of 26 (3 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2007	A Notch-Saddle-Compensation Technique in Butterfly-Type Laser Module Packages	Y.C. Hsu;Y.C. Tsai;J.H. Kuang;M.T. Sheen;A.D. Lin;P.H. Hsu;W.H. Cheng
國立中山大學	2005	A Novel Fiber Alignment Shift Measurement and Correction Technique in Laser-Welded Laser Module Packaging	Y.C. Hsu; Y.C. Tsai; Y.L. Ho; M.T. Sheen; J.H. Kuang; W.H. Cheng
國立中山大學	2005	The Joint Strength and Microstructure of Fluxless Au/Sn Solders in InP-Based Laser Diode Packages	M.T. Sheen;Y.H. Ho;C.L. Wang;K.C. Hsieh;W.H. Cheng
國立中山大學	2004	An Optimum Approach for Reduction of Fiber Alignment of Fiber-Solder-Ferrule Joints in Laser Module Packaging	W.H. Cheng;M.T. Sheen;C.M. Chang;Y.T. Tseng
國立中山大學	2004	Fiber Alignment Shifts in Butterfly Packaging by Laser Welding Technique: Measurement and Finite-Element-Method Analysis	Y.C. Hsu;W.K. Huang;M.T. Sheen;W.H. Cheng
國立中山大學	2003	Effect of Temperature Cycling on Angular Alignment on Angular Alignment in Add/Drop Filter Module Packaging	C.S. Hsieh; J.M. Chen; J.M. Hsu; M.T. Sheen; J.H. Kuang; W.H. Cheng
國立中山大學	2003	Effect of Temperature Cycling on Angular Alignment in Add/Drop Filter Module Packaging	C.S. Hsieh;J.M. Chen;J.M. Hsu;M.T. Sheen;J.K. Kuang;W.H. Cheng
國立中山大學	2002	The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages	M.T. Sheen; C.M. Chang; H.C. Teng; J.H. Kuang; K.C. Hsich; W.H. Cheng
國立中山大學	2002	The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages	M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kung;K.C. Hsieh;W.H. Cheng;
國立中山大學	2002	sThe Influence of Thermal Aging on Joint Strength and Fracture Surface of PbSn and AuSn Solders in Laser Diode Packages	M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kuang;K.C. Hsieh;W.H. Cheng

Showing items 1-10 of 26 (3 Page(s) Totally)
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