臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2015-06	Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls	Cheng, Hsin-En; Chen, Rong-Sheng; Mao, Chao-Yang
國立成功大學	2008-07-28	以最佳等效錫球觀念修正子模型分析法進行疊晶球柵陣列構裝錫球可靠度之最佳化分析	毛昭陽; Mao, Chao-Yang
國立成功大學	2008-01	Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint	Mao, Chao-Yang; Chen, Rong-Sheng

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