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Institution Date Title Author
義守大學 2006/08/26 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學 2006-08 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學 2006 薄型堆疊晶片銲線製程參數研究與最佳化設計 盧明正; Ming-cheng Lu

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