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Showing items 1-10 of 117 (12 Page(s) Totally)
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| 臺大學術典藏 |
2022-09-21T23:30:16Z |
Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies
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Liao, Bo Zhou; Chen, Liang Hsi; Chen, Kai Cheng; Lin, Hong Yi; Tsai, Yi Ting; Chen, Ting Wei; Chan, Yi Cheng; Lee, Min Hung; MING-HAN LIAO |
| 臺大學術典藏 |
2022-09-21T23:30:16Z |
Oxide Semiconductor Field-Effect Transistor for High-Resolution Displays Capable of Deep Black Display
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Okazaki, Yutaka; Sawai, Hiromi; Endo, Masami; Motoyoshi, Ryousuke; Shimada, Daigo; Kunitake, Hitoshi; Yamazaki, Shunpei; Huang, Kou Chang; Yoshida, Hiroshi; Chen, Min Cheng; MING-HAN LIAO; Chang, Shou Zen |
| 臺大學術典藏 |
2022-09-21T23:30:15Z |
1.5-inch, 3207-ppi Side-by-Side OLED Display Capable of 32-Division Driving with OSLSI/SiLSI Structure Fabricated by Photolithography
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Kozuma, Munehiro; Okamoto, Yuki; Ito, Minato; Lnoue, Hiroki; Saito, Toshihiko; Komura, Yusuke; Miyata, Shoki; Toyotaka, Kouhei; Matsuzaki, Takanori; Onuki, Tatsuya; Kobayashi, Hidetomo; Sugaya, Kentaro; Fujie, Takahiro; Okazaki, Yutaka; Hodo, Ryota; Yanagisawa, Yuichi; Wakuda, Masahiro; Murakawa, Tsutomu; Sasagawa, Shinya; Kunitake, Hitoshi; Nakamura, Daiki; Nagata, Takaaki; Fukuzaki, Shinya; Aoyama, Tomoya; Kimura, Hajime; Yen, Shih Ci; Chang, Chuan Hua; Hsieh, Wen Hsiang; Yoshida, Hiroshi; Chen, Min Cheng; MING-HAN LIAO; Chang, Shou Zen; Yamazaki, Shunpei |
| 臺大學術典藏 |
2022-09-21T23:30:15Z |
Layout of 1.50-inch, 3207-ppi oled display with oslsi/silsi structure capable of division driving fabricated through vlsi process with side-by-side patterning by photolithography
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Saito, Toshihiko; Mizuguchi, Toshiki; Okamoto, Yuki; Ito, Minato; Toyotaka, Kouhei; Kozuma, Munehiro; Matsuzaki, Takanori; Kobayashi, Hidetomo; Onuki, Tatsuya; Hiura, Yoshikazu; Hodo, Ryota; Sasagawa, Shinya; Kunitake, Hitoshi; Nakamura, Daiki; Sato, Hitomi; Kimura, Hajime; Wu, Chih Chiang; Yoshida, Hiroshi; Chen, Min Cheng; MING-HAN LIAO; Chang, Shou Zen; Yamazaki, Shunpei |
| 臺大學術典藏 |
2022-03-22T08:28:47Z |
In-Sn-Zn oxide nanocomposite films with enhanced electrical properties deposited by high-power impulse magnetron sputtering
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Sun H;Li Z.-Y;Chen S.-C;Liao M.-H;Gong J.-H;Bai Z;Wang W.-X.; Sun H; Li Z.-Y; Chen S.-C; Liao M.-H; Gong J.-H; Bai Z; Wang W.-X.; MING-HAN LIAO |
| 臺大學術典藏 |
2022-03-22T08:28:47Z |
In-Sn-Zn oxide nanocomposite films with enhanced electrical properties deposited by high-power impulse magnetron sputtering
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Sun H;Li Z.-Y;Chen S.-C;Liao M.-H;Gong J.-H;Bai Z;Wang W.-X.; Sun H; Li Z.-Y; Chen S.-C; Liao M.-H; Gong J.-H; Bai Z; Wang W.-X.; MING-HAN LIAO |
| 臺大學術典藏 |
2022-03-22T08:28:46Z |
The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology
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Yen C;Chang S;Chen K;Feng Y;Chen L;Liao B;Lee M;Chen S;Liao M.; Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO |
| 臺大學術典藏 |
2022-03-22T08:28:46Z |
The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology
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Yen C;Chang S;Chen K;Feng Y;Chen L;Liao B;Lee M;Chen S;Liao M.; Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO |
| 臺大學術典藏 |
2022-03-22T08:25:59Z |
The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology
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Yen C;Chang S;Chen K;Feng Y;Chen L;Liao B;Lee M;Chen S;Liao M.; Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO |
| 臺大學術典藏 |
2022-03-22T08:25:59Z |
In-Sn-Zn oxide nanocomposite films with enhanced electrical properties deposited by high-power impulse magnetron sputtering
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Sun H;Li Z.-Y;Chen S.-C;Liao M.-H;Gong J.-H;Bai Z;Wang W.-X.; Sun H; Li Z.-Y; Chen S.-C; Liao M.-H; Gong J.-H; Bai Z; Wang W.-X.; MING-HAN LIAO |
Showing items 1-10 of 117 (12 Page(s) Totally)
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