| 元智大學 |
Sep-17 |
TEM Investigation of Interfacial Microstructure and Fracture Mode of the Sn-Ag-Cu/Ni Joint System
|
Cheng-En Ho; Ming-Kai Lu; Pei-Tzu Lee; Yu-Hsuan Huang; Wei-Ling·Chou |
| 元智大學 |
Nov-14 |
Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode
|
Cheng-En Ho; Wan-Zhen Hsieh; Chang-Chih Chen; Ming-Kai Lu |
| 元智大學 |
Jun-15 |
Electron Backscatter Diffraction Characterization of Electrolytic Cu Deposition in the Blind-hole Structure: Current Density Effect
|
Cheng-En Ho; Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu |
| 元智大學 |
Dec-14 |
Electron Backscatter Diffraction Characterization of Blind Hole Fillings by Electrolytic Cu Deposition
|
Cheng-En Ho; Ling-Huang Hsu; Chang-Chih Chen; Ming-Kai Lu |
| 元智大學 |
Aug-16 |
In-situ Study on the Self-annealing Behavior of Electroplated Cu through the Cantilever Method, XRD, and EBSD
|
Cheng-En Ho; Chang-Chih Chen; Ming-Kai Lu; Yu-Wei Lee; Ying-Syuan Wu |
| 元智大學 |
2017 |
銅濃度效應對Sn-Ag-Cu/Ni銲點之界面微結構及機械可靠度的影響
|
呂名凱; Ming-Kai Lu |
| 元智大學 |
2014-10-22 |
Microstructural and Crystallographic Evolutions of Electroplating Cu in Blind Hole Structure
|
Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu; Cheng-En Ho |
| 元智大學 |
2014-10-22 |
Microstructural and Crystallographic Evolutions of Electroplating Cu in Blind Hole Structure
|
Chang-Chih Chen; Ling-Huang Hsu; Ming-Kai Lu; Cheng-En Ho |
