臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2017-06	競技桌球暫停策略之個案分析	許銘華;陳明坤;周資眾; Ming-Hua Hsu;Ming-Kun Chen;Tz-Chung Chou
義守大學	2015-07	Fabrication and characterization of low-cost ultrathin flexible polyimide interposer	Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2014-02	Failure analysis of EOS-induced damage at final electrical testing	Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	Fabrication and Characterization of Cu-Plated Fine Pitch Patterns on Flexible Polyimide	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Ling-Sheng Jang
義守大學	2012-11	Design of AC-Coupled Circuit for High-speed Interconnects	Chun-Wei Huang;Kai-Jen Liu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-11	Micro-scale Cu metallization on polyimide substrate for high-speed interconnects	Ya-Hui Tseng;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu

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