臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"ming kun chen"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 1-23 of 23 (1 Page(s) Totally)
1
View [10|25|50] records per page

Institution	Date	Title	Author
義守大學	2017-06	競技桌球暫停策略之個案分析	許銘華;陳明坤;周資眾; Ming-Hua Hsu;Ming-Kun Chen;Tz-Chung Chou
義守大學	2015-07	Fabrication and characterization of low-cost ultrathin flexible polyimide interposer	Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2014-02	Failure analysis of EOS-induced damage at final electrical testing	Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	Fabrication and Characterization of Cu-Plated Fine Pitch Patterns on Flexible Polyimide	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Ling-Sheng Jang
義守大學	2012-11	Design of AC-Coupled Circuit for High-speed Interconnects	Chun-Wei Huang;Kai-Jen Liu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-11	Micro-scale Cu metallization on polyimide substrate for high-speed interconnects	Ya-Hui Tseng;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-01	Simulation and Modeling of Capacitive Coupling Interconnection For 3D Integration	Kai-Jen Liu;Chun-Wei Huang;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2010-05	Hardware Implementation of RFID Mutual Authentication Protocol	Yu-Jung Huang;Ching-Chien Yuan;Ming-Kun Chen;Wei-Cheng Lin;Hsien-Chiao Teng
義守大學	2009-08	Design of patch antenna for RFID reader applications	Pei-Ju Lin;Hsien-Chiao Teng;Yu-Jung Huang;Ming-Kun Chen
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Implementation and application of UHF RFID antenna	Chia-Hao Yen;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Wei-Cheng Lin
義守大學	2007-11	Study of contact degradation in final testing for BGA socket	Hsien-Chiao Teng;Ming-Kun Chen;Chia-Hao Yen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Planar antennas on flexible substrate for wireless applications	Hsien-Chiao Teng;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2006-12	Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA	Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu
義守大學	2006-10	Electrical characterization of FCBGA package based on measurement approach for high-speed SOC applications	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang
義守大學	2006-04	Nondestructive analysis of interconnection in two-die BGA using TDR	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang
義守大學	2002-12	Failure analysis of BGA package by a TDR approach	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu
義守大學	2002-12	Electrical characterization of BGA test socket for high-speed applications	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;Li-Kuei Fang
義守大學	2002	高速負載板電磁干擾分析與故障模型建立之研究	陳明坤; ming-kun chen

Showing items 1-23 of 23 (1 Page(s) Totally)
1
View [10|25|50] records per page

	English \| 正體中文 \| 简体中文 \| Total items :2850591
	Visitors : 44698271 Online Users : 1112 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library