| 國立成功大學 |
2013-04 |
Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2012-09 |
Electrochemical Corrosion Behaviour of Lead-Free Solder Alloys in 3.5% Nacl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2012-04 |
Nanoscale Electrodeposition of Copper on an AFM Tip and Its Morphological Investigations
|
Mohanty, Udit Surya; Chen, S. Y.; Lin, Kwang-Lung |
| 國立成功大學 |
2009-07 |
Effect of residual stress on nanoindented property of Si/C/Si multilayers
|
Wu, Bo-Hsiung; Chung, Chen-Kuei; Shih, Ting-Ruen; Peng, Cheng-Chang; Mohanty, Udit-Surya |
| 國立成功大學 |
2009-03-20 |
Synthesis and characterization of Sn-3.5Ag-XZn alloy nanoparticles by the chemical reduction method
|
Lin, Chin-Yang; Mohanty, Udit-Surya; Chou, Jung-Hua |
| 國立成功大學 |
2009-02-20 |
Preparation of Sn-3.5Ag nano-solder by supernatant process
|
Lin, Chin-Yang; Chou, Jung-Hua; Lee, Y. G.; Mohanty, Udit-Surya |
| 國立成功大學 |
2008-09 |
Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2008-02 |
Role of Mo6+ during nickel electrodeposition from sulfate solutions
|
Mohanty, Udit-Surya; Tripathy, B. C.; Singh, P.; Das, S. C.; Misra, V. N. |
| 國立成功大學 |
2008 |
Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip
|
Lin, Kwang-Lung; Chen, S. Y.; Mohanty, Udit-Surya |
| 國立成功大學 |
2007-09 |
Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2007-07 |
The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1A1-0.05Ga alloy in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2006 |
Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-12 |
Effect of thiourea during nickel electrodeposition from acidic sulfate solutions
|
Mohanty, Udit-Surya; Tripathy, B. C.; Das, S. C.; Misra, V. N. |
| 國立成功大學 |
2005-10-15 |
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit-Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-06 |
Electrodeposition of nickel in the presence of Al3+ from sulfate baths
|
Mohanty, Udit-Surya; Tripathy, B. C.; Singh, P.; Das, S. C.; Misra, V. N. |
