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Showing items 1-10 of 19  (2 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:46:31Z Enhancing the oxygen plasma resistance of low-k methylsilsesquioxane by H-2 plasma treatment Liu, PT; Chang, TC; Mor, YS; Sze, SM
國立交通大學 2014-12-08T15:46:15Z Effects of H-2 plasma treatment on low dielectric constant methylsilsesquioxane Chang, TC; Liu, PT; Mei, YJ; Mor, YS; Perng, TH; Yang, YL; Sze, SM
國立交通大學 2014-12-08T15:46:11Z The novel improvement of low dielectric constant methylsilsesquioxane by N2O plasma treatment Chang, TC; Liu, PT; Mor, YS; Sze, SM; Yang, YL; Feng, MS; Pan, FM; Dai, BT; Chang, CY
國立交通大學 2014-12-08T15:46:05Z The novel precleaning treatment for selective tungsten chemical vapor deposition Chang, TC; Mor, YS; Liu, PT; Sze, SM; Yang, YL; Tsai, MS; Chang, CY
國立交通大學 2014-12-08T15:44:42Z Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric Liu, PT; Chang, TC; Huang, MC; Yang, YL; Mor, YS; Tsai, MS; Chung, H; Hou, J; Sze, SM
國立交通大學 2014-12-08T15:43:16Z Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM
國立交通大學 2014-12-08T15:43:16Z The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM
國立交通大學 2014-12-08T15:43:16Z Improvement of low dielectric constant methylsilsesquioxane by boron implantation treatment Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Sze, SM; Mei, YJ
國立交通大學 2014-12-08T15:43:11Z Effectiveness of NH3 plasma treatment in preventing wet stripper damage to low-k hydrogen silsesquioxane (HSQ) Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM
國立交通大學 2014-12-08T15:42:46Z Effective strategy for porous organosilicate to suppress oxygen ashing damage Liu, PT; Chang, TC; Mor, YS; Chen, CW; Tsai, TM; Chu, CJ; Pan, FM; Sze, SM

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