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Showing items 11-19 of 19  (1 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:42:32Z Preventing dielectric damage of low-k organic siloxane by passivation treatment Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM
國立交通大學 2014-12-08T15:42:15Z Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment Chang, TC; Liu, PT; Mor, YS; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM
國立交通大學 2014-12-08T15:42:14Z Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment Mor, YS; Chang, TC; Liu, PT; Tsai, TM; Chen, CW; Yan, ST; Chu, CJ; Wu, WF; Pan, FM; Lur, W; Sze, SM
國立交通大學 2014-12-08T15:42:08Z Recovering dielectric loss of low dielectric constant organic siloxane during the photoresist removal process Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Sze, SM
國立交通大學 2014-12-08T15:41:53Z Trimethylchlorosilane treatment of ultralow dielectric constant material after photoresist removal processing Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Chu, CJ; Pan, FM; Lur, W; Sze, SM
國立交通大學 2014-12-08T15:41:39Z The novel pattern method of low-k hybrid-organic-siloxane-polymer film using X-ray exposure Chang, TC; Tsai, TM; Liu, PT; Mor, YS; Chen, CW; Mei, YJ; Sheu, JT; Tseng, TY
國立交通大學 2014-12-08T15:41:07Z Moisture-induced material instability of porous organosilicate glass Chang, TC; Chen, CW; Liu, PT; Mor, YS; Tsai, HM; Tsai, TM; Yan, ST; Tu, CH; Tseng, TY; Sze, SM
國立交通大學 2014-12-08T15:40:54Z Direct Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology Chang, TC; Tsai, TM; Liu, PT; Mor, YS; Chen, CW; Sheu, JT; Tsengb, TY
國立交通大學 2014-12-08T15:40:42Z Direct Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology (vol 6, pg G69, 2003) Chang, TC; Tsai, TM; Liu, PT; Mor, YS; Chen, CW; Sheu, JT; Tseng, TY

Showing items 11-19 of 19  (1 Page(s) Totally)
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