| 國立成功大學 |
2021 |
Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In
|
Hirata, Y.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H. |
| 臺大學術典藏 |
2020-05-12T02:53:41Z |
Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose
|
Chou, T.-T.; Tuan, W.-H.; Nishikawa, H.; Weng, B.-J.; WEI-HSING TUAN |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 國立成功大學 |
2019 |
The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
|
Zhou, S.;Yang, C.-H.;Shen, Y.-A.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
|
Shen, Y.-A.;Zhou, S.;Li, J.;Yang, C.-H.;Huang, S.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
|
Zhou, S.;Yang, C.-H.;Lin, S.-K.;AlHazaa, AlHazaa A.N.;Mokhtari, O.;Liu, X.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Development of Sn-Bi-In-Ga quaternary low-Temperature solders
|
Yang, C.-H.;Zhou, S.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
The study of Sn-45Bi-2.6Zn alloy before and after thermal aging
|
Zhou, S.;Yang, C.-H.;Shen, Y.-A.;Lin, S.-K.;Nishikawa, H. |
