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Institution	Date	Title	Author
國立交通大學	2017-04-21T06:56:20Z	Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling	Takahashi, Yuya; Chen, Lin; Okajima, Junnosuke; Iga, Yuka; Komiya, Atsuki; Fu, Wu-Shung; Maruyama, Shigenao

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