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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-12T01:21:47Z |
無電鍍鈷鎢磷薄膜對銲錫之擴散阻障特性研究
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潘虹君; Pan, Hung-Chun; 謝宗雍; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:21:08Z |
Diffusion barrier characteristics and shear fracture behaviors of eutectic PbSn solder/electroless Co(W,P) samples
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Pan, Hung-Chun; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:20:51Z |
Diffusion Barrier Characteristics of Electroless Co(W,P) Thin Films to Lead-Free SnAgCu Solder
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Pan, Hung-Chun; Hsieh, Tsung-Eong |
| 國立交通大學 |
2014-12-08T15:12:50Z |
Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy
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Wu, W. C.; Hsieh, Tsung-Eong; Pan, Hung-Chun |
| 國立交通大學 |
2014-12-08T15:12:03Z |
An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W, P) Layer to Lead-Free SnBi Solder
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Pan, Hung-Chun; Hsieh, Tsung-Eong |
| 國立成功大學 |
2013-10-01 |
Investigation of vulcanization of non-crystalline Cu2ZnSnS4 nano-particles
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Wu, Shih Hsiung; Shih, Chuan Feng; Pan, Hung Chun; Wang, Yu Yun; Chen, Ho Min; Wu, Chung Shin |
| 國立成功大學 |
2012-07 |
Investigation of vulcanization of non-crystalline Cu2ZnSnS4 nano-particles
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Wu, Shih-Hsiung; Shih, Chuan Feng; Pan, Hung Chun; Wang, Yu Yun; Wu, Chung Shin |
Showing items 1-7 of 7 (1 Page(s) Totally)
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