臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
義守大學	2017-12	利用表面蝕刻消除於雷射藍寶石研磨加工產生之應力	金佩傑;吳士傑; Pei-Chieh Chin;Shih-Jeh Wu
義守大學	2016-07	The Application of General Homotopy Method on Planar Four-Bar Path Synthesis	Pei-chieh Chin;Hsiang-chen Hsu;Shen-li Fu
義守大學	2015-12	The Path Generation of Planar Four-bar Mechanisms Using General Homotopy Method	Pei-Chieh Chin; 金佩傑
國立高雄師範大學	2015-06-01	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2015-06	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2009-10	Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding	Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2006/08/26	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學	2006/08/26	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學	2006-08	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學	2006-08	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen

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