臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| Total items :0
	Visitors : 51776326 Online Users : 970 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library

Scope

Adv. Search

Login

Administrator

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"pei chieh chin"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 1-10 of 12 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
義守大學	2017-12	利用表面蝕刻消除於雷射藍寶石研磨加工產生之應力	金佩傑;吳士傑; Pei-Chieh Chin;Shih-Jeh Wu
義守大學	2016-07	The Application of General Homotopy Method on Planar Four-Bar Path Synthesis	Pei-chieh Chin;Hsiang-chen Hsu;Shen-li Fu
義守大學	2015-12	The Path Generation of Planar Four-bar Mechanisms Using General Homotopy Method	Pei-Chieh Chin; 金佩傑
國立高雄師範大學	2015-06-01	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2015-06	超音波脈衝回波法量測硬脆材料特性之探討	金佩傑;吳士傑;劉杰靈; Pei-Chieh Chin;Shih-Jeh Wu;Hawking Liu
義守大學	2009-10	Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding	Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2006/08/26	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學	2006/08/26	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng

Showing items 1-10 of 12 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page