臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"pei tzu lee"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 1-25 of 25 (1 Page(s) Totally)
1
View [10|25|50] records per page

Institution	Date	Title	Author
元智大學	Sep-18	Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects	Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Sep-17	TEM Investigation of Interfacial Microstructure and Fracture Mode of the Sn-Ag-Cu/Ni Joint System	Cheng-En Ho; Ming-Kai Lu; Pei-Tzu Lee; Yu-Hsuan Huang; Wei-Ling·Chou
元智大學	Sep-16	Real-time Study of Electromigration in Sn Blech Structure	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學	Oct-18	High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage	Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jun-22	Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jun-15	Effect of Pd(P) Thickness on the Soldering Reaction between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad	Cheng-En Ho; Ling-Huang Hsu; Cheng-Hsien Yang; Ting-Chun Yeh; Pei-Tzu Lee
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-19	Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification	Yu-Hsuan Huang; Shu-Ping Yang; Pei-Tzu Lee; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Aug-21	High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)	Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho
元智大學	Aug-16	Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications	Pei-Tzu Lee; Wan-Zhen Hsieh; Ting-Chun Yeh; Hsiao-Keng Wang; Cheng-En Ho
元智大學	Aug-16	Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints	Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang
東海大學	2019	酸對生活於容器性積水蝌蚪的影響	李珮慈; Pei-Tzu Lee
元智大學	2018-11-16	Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth	Wan-Zhen Hsieh; Pei-Tzu Lee; Wei-Ling·Chou; Ching-Shun Ku; Cheng-En Ho
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho
元智大學	2018	高速電鍍銅及其於電子封裝之應用	李珮慈; Pei-Tzu Lee
元智大學	2017-10-25	Significant Improvement of Electrochemical Corrosion and Thermal Stability of EPIG (Au/Pd) Surface Finish by Depositing A Au Nanolayer	Yu-Hsuan Huang; Yu-Xuan Wang; Pei-Tzu Lee; Shu-Ping Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2017-04-25	Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate	Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學	2017-04-25	Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities	Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學	2016-10-26	High-Current-Density Electroplating Cu and Its Solderability	Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學	2016-10-26	Microstructure and Its Reliability of High-speed Cu Electrodeposition	Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo

Showing items 1-25 of 25 (1 Page(s) Totally)
1
View [10|25|50] records per page

	English \| 正體中文 \| 简体中文 \| Total items :2818748
	Visitors : 28327635 Online Users : 477 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library