臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| 总笔数 :2819016
	造访人次 : 28408694 在线人数 : 447 教育部委托研究计画计画执行:国立台湾大学图书馆

搜寻范围

进阶搜寻

登入

管理

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

关于TAIR
	计画说明

浏览
	典藏机构
	作者
	题名
	日期
	统计图表
	机构即时统计
	学术趋势

消息
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

著作权
	出版社及期刊政策查询
	TAIR著作权会议记录

相关连结
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"pei tzu lee"的相关文件

回到依作者浏览
依题名排序	依日期排序

显示项目 11-25 / 25 (共1页)
1
每页显示[10|25|50]项目

机构	日期	题名	作者
元智大學	Jan-19	Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification	Yu-Hsuan Huang; Shu-Ping Yang; Pei-Tzu Lee; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Aug-21	High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)	Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho
元智大學	Aug-16	Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications	Pei-Tzu Lee; Wan-Zhen Hsieh; Ting-Chun Yeh; Hsiao-Keng Wang; Cheng-En Ho
元智大學	Aug-16	Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints	Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang
東海大學	2019	酸對生活於容器性積水蝌蚪的影響	李珮慈; Pei-Tzu Lee
元智大學	2018-11-16	Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth	Wan-Zhen Hsieh; Pei-Tzu Lee; Wei-Ling·Chou; Ching-Shun Ku; Cheng-En Ho
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho
元智大學	2018	高速電鍍銅及其於電子封裝之應用	李珮慈; Pei-Tzu Lee
元智大學	2017-10-25	Significant Improvement of Electrochemical Corrosion and Thermal Stability of EPIG (Au/Pd) Surface Finish by Depositing A Au Nanolayer	Yu-Hsuan Huang; Yu-Xuan Wang; Pei-Tzu Lee; Shu-Ping Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2017-04-25	Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate	Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學	2017-04-25	Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities	Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學	2016-10-26	High-Current-Density Electroplating Cu and Its Solderability	Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學	2016-10-26	Microstructure and Its Reliability of High-speed Cu Electrodeposition	Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo

显示项目 11-25 / 25 (共1页)
1
每页显示[10|25|50]项目