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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
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Institution Date Title Author
元智大學 2017-04-25 Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學 2017-04-25 Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學 2016-10-26 High-Current-Density Electroplating Cu and Its Solderability Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學 2016-10-26 Microstructure and Its Reliability of High-speed Cu Electrodeposition Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學 2016-10-26 Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo

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