臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	2017-04-25	Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate	Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學	2017-04-25	Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities	Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學	2016-10-26	High-Current-Density Electroplating Cu and Its Solderability	Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學	2016-10-26	Microstructure and Its Reliability of High-speed Cu Electrodeposition	Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo

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