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"peng w c"
Showing items 26-30 of 30 (1 Page(s) Totally)
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| 國立臺灣大學 |
2011 |
Influences of process parameters on texture and microstructure of NiO films
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Kuo, T.Y.; Chen, S.C.; Peng, W.C.; Lin, Y.C.; Lin, H.C. |
| 國立臺灣大學 |
2011 |
Microstructure and Magnetic Properties of In-Situ Deposited L1(0) FePt Films on MgO(200) Films of Varying Thicknesses
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Chen, S.C.; Sun, T.H.; Shen, C.L.; Peng, W.C.; Chen, C.D.; Kuo, P.C.; Chen, J.R. |
| 臺大學術典藏 |
2006 |
Enhanced colossal electroresistance in Cu/Pr0.7Ca 0.3MnO3/Cu structure
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Wu, J. H.; Lin, J. G.; Peng, W. C. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
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Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
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Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
Showing items 26-30 of 30 (1 Page(s) Totally)
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