| 義守大學 |
2009/12/09 |
An improvement method for the reliability of copper metallization process
|
Po-Ying Chen ; Po-Han Wu ; Woei Jye Ong |
| 義守大學 |
2009-12 |
Investigation of the Relationship between Whole -Wafer Strength and Control of its Edge Engineering
|
Po-Ying Chen;Ming-Hsing Tsai;Wen-Kuan Yeh;Ming-Haw Jing;Yukon Chang |
| 義守大學 |
2009-08 |
Development of a brand new system using RFID combining with wireless sensor network (WSNs) for real-time doze alarm
|
Po-Ying Chen;Po-Han Wu;Woei Jye Ong;Yu-Jung Huang;Wei-cheng Lin;Tsung-Long Pan |
| 義守大學 |
2009-08 |
Development of a brand new system using RFID combining with wireless sensor network (WSNs) for real-time doze alarm
|
Po-Ying Chen;Po-Han Wu;Woei Jye Ong;Yu-Jung Huang;Wei-cheng Lin;TSung-long Pan |
| 義守大學 |
2009-03 |
The Impact of Strain Technology on FUSI Gate SOI CMOSFET
|
Wen-Kuan Yeh;Jean-An Wang;Ming-Hsing Tsai;Chien-Ting Lin;Po-Ying Chen |
| 義守大學 |
2008/08/20 |
Dynamic scanning method to clarify the mechanism of WLCSP package reliability issue
|
Po-Ying Chen ; Chwei-Shyong Tsai ; Ming-Hsiung Tsai ; Heng-Yu Kung ; Shen-Li Chen ; Jing, M.H. ; Wen-Kuan Yeh |
| 義守大學 |
2008/04/27 |
Effect of crystal-originated particles (COPs) on ULSI process integrity
|
Po-Ying Chen ; Chen, S.L. ; Tsai, M.H. ; Jing, M.H. ; Lin, T.-C. ; Wen-Kuan Yeh |
| 義守大學 |
2008-12 |
Degradation of Gate Oxide Integrity by Formation of Tiny Holes by Metal Contamination of Raw Wafer
|
Po-Ying Chen |
| 義守大學 |
2008-10 |
Elucidating the effects of current stress history on reliability characteristics by dynamic analysis
|
Po-Ying Chen;Shen-Li Chen;Ming-Hsiung Tsai;Wen-Kuan Yeh;Heng-Yu Kung;YuKon Chang |
| 義守大學 |
2008-02 |
Reliability and characteristics of wafer-level chip-scale packages under current stress
|
Po-Ying Chen;Heng-Yu Kung;Yi-Shao Lai;Ming Hsiung Tsai;Wen-Kuan Yeh |
| 義守大學 |
2008 |
Characteristics of spontaneous reaction occurred by metal contamination and silicon substrate for ultralarge-scale integration semiconductor process
|
Po-Ying Chen |
| 義守大學 |
2007/12/20 |
Investigation of Electrostatic Charges Trapping during 12-Inch Deep Submicron VLSI Proces
|
Po-Ying Chen ; Chen, S.L. ; Tsai, M.H. ; Jing, M.H. ; Lin, T.-C. |
| 義守大學 |
2007/12/20 |
Implement of an Improvement Particle Monitoring Methodology in an Industry Production Process
|
Po-Ying Chen ; Chen, S.L. ; Tsai, M.H. ; Jing, M.H. ; Lin, T.-C. |
| 義守大學 |
2007/12/20 |
Investigation of Wafer Strength in 12 inch Bare Wafer for Prevent Wafer Breakage
|
Po-Ying Chen ; Jing, M.H. ; Tin, T.C. |
| 義守大學 |
2007/07/11 |
The Defects of Silicon Reacted with Carbon Content Vapour in ULSI Nano-meter-Generation Technology
|
Po-Ying Chen ; Shen-Li Chen ; Ming-Hsiung Tsai ; Jing, M.H. ; Lin, T.-C. ; Cheng-Chia Kuo |
| 義守大學 |
2007/07/11 |
The Defects of Silicon Reacted with Carbon Content Vapour in ULSI Nano-meter-Generation Technology
|
Po-Ying Chen ; Shen-Li Chen ; Ming-Hsiung Tsai ; Jing, M.H. ; Lin, T.-C. ; Cheng-Chia Kuo |
| 義守大學 |
2007/07/11 |
The Failure Mode Investigation of Barrier Layer TaN Combined with Al Pad Architecture using in Cu Process
|
Po-Ying Chen ; Shen-Li Chen ; Ming-Hsiung Tsai ; Jing, M.H. ; Lin, T.-C. |
| 義守大學 |
2006/12/06 |
The effect of stressing history in reliability characteristics
|
Po-Ying Chen ; Heng-Yu Kung ; Yi-Shao Lai ; Wen-Kuan Yeh |
| 中原大學 |
2005-07-28 |
以BPEL為基礎的服務導向式心臟照護系統之設計與實作
|
陳柏穎; po-ying chen |
