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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
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Showing items 36-45 of 275  (28 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2018-09-10T09:50:20Z Development of millimeter-wave passive components and system-in-packages by LTCC technology R.-B. Wu;T.-M. Shen;T.-Y. Huang; R.-B. Wu; T.-M. Shen; T.-Y. Huang; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:50:20Z Development of millimeter-wave passive components and system-in-packages by LTCC technology R.-B. Wu;T.-M. Shen;T.-Y. Huang; R.-B. Wu; T.-M. Shen; T.-Y. Huang; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:50:20Z Characterization of TSVs by cascaded daisy chains Y.-C. Wu;K.-B. Wu;K.-Y. Yang;T.-Y. Huang;R.-B. Wu; Y.-C. Wu; K.-B. Wu; K.-Y. Yang; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:50:20Z Characterization of TSVs by cascaded daisy chains Y.-C. Wu;K.-B. Wu;K.-Y. Yang;T.-Y. Huang;R.-B. Wu; Y.-C. Wu; K.-B. Wu; K.-Y. Yang; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:50:19Z SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections Y.-S. Cheng;B. Liu;R.-B. Wu; Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:50:19Z SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections Y.-S. Cheng;B. Liu;R.-B. Wu; Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:25:29Z 60-GHz four-element phased-array transmit/receive system-in-package using phase compensation techniques in 65-nm flip-chip CMOS process Y.-F. Lu; T.-Y. Huang; Y.-L. Chang; Y.-K. Hsieh; P.-J. Peng; I.-C. Chang; T.-C. Tsai; K.-Y. Kao; W.-Y. Hsiung; J. Wang; Y. A. Hsu; K.-Y. Lin; H.-C. Lu; Y.-C. Lin; L.-H. Lu; T.-W. Huang; R.-B. Wu; H. Wang; J.-L. Kuo; LIANG-HUNG LU et al.
臺大學術典藏 2018-09-10T09:24:42Z Development of wideband electrically identical fan-out structure for 60 GHz frontend phased array system in package module T.-Y. Huang;R.-B. Wu; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:24:42Z Development of wideband electrically identical fan-out structure for 60 GHz frontend phased array system in package module T.-Y. Huang;R.-B. Wu; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU
臺大學術典藏 2018-09-10T09:24:42Z An integrated filtering antenna array with 180 degree hybrid for SiP front end module C.-C. Chen;T.-M. Shen;C.-F. Chen;T.-Y. Huang,;R.-B. Wu; C.-C. Chen; T.-M. Shen; C.-F. Chen; T.-Y. Huang,; R.-B. Wu; RUEY-BEEI WU

Showing items 36-45 of 275  (28 Page(s) Totally)
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