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Showing items 1-9 of 9 (1 Page(s) Totally)
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| 臺大學術典藏 |
2021-08-05T02:41:49Z |
Device pattern impact on optical endpoint detection by interferometry for STI CMP
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Bourzgui S;Roussy A;Blue J;Georges G;Faivre E;Labory K;Allard A.; Bourzgui S; Roussy A; Blue J; Georges G; Faivre E; Labory K; Allard A.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:10Z |
Efficient FDC based on hierarchical tool condition monitoring scheme
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Blue, J.; Roussy, A.; Thieullen, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
Run-To-Run sensor variation monitoring for process fault diagnosis in semiconductor manufacturing
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Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
FDC R2R variation monitoring for sensor level diagnosis in tool condition hierarchy
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Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
The light behavior from shallow trench isolation profiles at chemical mechanical planarization step and correlation with optical endpoint system by interferometry
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Bourzgui, S.; Georges, G.; Roussy, A.; Blue, J.; Faivre, E.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
Key Effects and Process Parameters Extraction on the CD of Reactive Ion Etching (RIE) Based on DOE Modeling
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Rizquez, M.; Roussy, A.; Blue, J.; Bucelle, L.; Pinaton, J.; Pasquet, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:07Z |
Advanced run-to-run controller in semiconductor manufacturing with real-time equipment condition: APC: Advanced process control; AM: Advanced metrology
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Yang, W.-T.; Blue, J.; Roussy, A.; Reis, M.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:06Z |
Virtual metrology modeling based on Gaussian Bayesian network
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Yang, W.-T.; Blue, J.; Roussy, A.; Reis, M.S.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2013 |
Tool condition diagnosis with a recipe-independent hierarchical monitoring scheme
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Blue, J.; Gleispach, D.; Roussy, A.; Scheibelhofer, P.; JAKEY BLUE |
Showing items 1-9 of 9 (1 Page(s) Totally)
1
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