臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2018-09-10T07:09:18Z	Thermal conduction analysis on microwave IC packages	J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG
中原大學	2010-10	Effect of Organoclay on the Mechanical/Thermal Properties of Microcellular Injection Molded PBT-Clay Nanocomposites	S.-S. Huang; S.-P. Liu; P-P. Hsu;J. -M. Yeh;K.-C. Chang; Y.-Z. Lai
國立中山大學	2006	Technological Innovation Assessment on B-to-B Electronic Marketplaces	Y.C. Wu;S.P. Liu

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