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Institution Date Title Author
國立成功大學 2009-02 Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry Wu, Y. K.; Lin, Kwang-Lung; Salam, B.
國立成功大學 2009-01 Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints Lai, R. S.; Lin, Kwang-Lung; Salam, B.
國立成功大學 2009 Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders Yeh, T. K.; Lin, Kwang-Lung; Salam, B.
國立成功大學 2008 Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders Lai, R. S.; Lin, Kwang-Lung; Salam, B.

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