|
English
|
正體中文
|
简体中文
|
2823024
|
|
???header.visitor??? :
30209743
???header.onlineuser??? :
825
???header.sponsordeclaration???
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"salam b"???jsp.browse.items-by-author.description???
Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立成功大學 |
2009-02 |
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
|
Wu, Y. K.; Lin, Kwang-Lung; Salam, B. |
國立成功大學 |
2009-01 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
國立成功大學 |
2009 |
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
|
Yeh, T. K.; Lin, Kwang-Lung; Salam, B. |
國立成功大學 |
2008 |
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
|