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Institution Date Title Author
國立成功大學 2012-12 Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao
國立高雄第一科技大學 2007-07-18 不同的電流密度與基材在複合式99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu覆晶銲錫凸塊電遷移效應之研究 邵郁琇; Shao Yu-hsiu

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